A copperhead title card: a Formula 1 car in side profile as a single copper silhouette, speed lines behind it.
Summary

Two boards for Kyra, glasses and a ring, taken from a two-sentence public roadmap to part selection in a day. A test of the claim that hardware design can move as fast as software, with every stage a commit.

On 27 August I replied to Kyra’s founder Sahil Dhull that hardware design should move as fast as software[1]. On 2 September we tried to prove it with Kyra’s own public roadmap, which is two sentences. We took two boards to part selection before lunch. This is the record, with the commits.

The reports

Cover page of the Kyra R1 EV1 glasses design package, revision 3297c80. Cover page of the Kyra R1 EV1 ring design package, revision c19ab02.

The first page of each design package, the glasses and then the ring. Each opens the full PDF.
Design package Revision Pages File
Kyra R1 EV1, the escalation glasses engine 3297c80 88 PDF, 0.9 MB
Kyra R1 EV1, the escalation ring engine c19ab02 102 PDF, 1.0 MB
Drawing Sheet File
FIG. 1, the glasses exploded patent style, reference numerals SVG
FIG. 2, the ring exploded along its axis patent style, reference numerals SVG
KYRA-GL-001, the glasses, dimensioned A3, 1:1, third angle SVG
KYRA-RG-001, the ring, dimensioned A4, 2:1, third angle, section A-A SVG

The input

Kyra’s entire public hardware specification, quoted in full from kyrainterface.com[2]:

Mac and iOS first, because that is where your work happens. Then ambient glasses controlled by a ring: reply, dismiss or confirm with your thumb.

Plus a privacy commitment: your data stays with you. No part numbers, no budgets, no dimensions, no display or camera decision. The evening before, Sahil Dhull had posted a working V0 of the glasses, demonstrated by making a phone call through them[3]. That post settled one question the roadmap did not: the glasses have an audio path.

The record

Hashes are commits in the two design repositories; each stage of the pipeline commits when its completion contract holds, so the hash is the evidence[4][5]. The pipeline is copperhead create. The scope was its first three stages, specification, architecture and part selection, stopped by design at the schematic boundary.

Ring Glasses
Workspace created f4a625b ed41083
Stage 1, specification 25m 19s, 786b723 28m 17s, 0c2f005
Stage 2, architecture 11m 01s, 370678f 7m 51s, abad67f
Stage 3, part selection 43m 28s, c19ab02 48m 44s, 3297c80
Stages 1 to 3 1h 20m 1h 25m
Placed symbols 90 90
Design package 102 pages 88 pages

The ring’s brief was written the night before, from the roadmap above and a market study, with ten engineering decisions taken in the absence of a client and the consequence of each written down. The glasses’ brief was written while the ring ran, after every candidate part had been checked against the 222 symbol libraries on the machine, because a part without a symbol makes a run unwinnable. Between the two sits the contract that ties the boards together: glasses as the escalation surface, ring as the confirm surface, four links between them and the phone. Both design packages were assembled from the stage commits: brief, specification, architecture, bill of materials, decision log, change log and every requirement file.

What each stage cost

Every figure here is read off the Claude Agent SDK’s own usage record, one line per API call and priced at the published Claude Opus 5 rates: $5 per million input tokens, $10 per million written to the one hour cache, $0.50 per million read back from it and $25 per million output tokens[6]. The model was claude-opus-5 for every call.

Board and stage Wall clock API calls Output tokens Cache write, 1h Cache read Cost
Ring, 1 specification 25m 19s 16 48,022 369,825 35,848 $4.92
Ring, 2 architecture 11m 01s 21 19,494 186,902 206,946 $2.46
Ring, 3 part selection 43m 28s 39 60,084 409,312 676,154 $5.93
Ring, stages 1 to 3 1h 20m 76 127,600 966,039 918,948 $13.31
Glasses, 1 specification 28m 17s 24 33,360 420,245 48,267 $5.06
Glasses, 2 architecture 7m 51s 15 13,924 108,977 111,505 $1.49
Glasses, 3 part selection 48m 44s 46 88,789 361,341 648,214 $6.16
Glasses, stages 1 to 3 1h 25m 85 136,073 890,563 807,986 $12.71
Both boards 2h 45m 161 263,673 1,856,602 1,726,934 $26.02

Uncached input across the six stages is 164 tokens. The harness writes each turn’s context into the one hour cache and reads it back on the next turn, so the bill sits in two lines: cache writes at $18.57 and output tokens at $6.59. Reads are $0.86. Writes cost more than output because every turn appends to the context and the appended part is written at twice the input price. The five minute cache, at 1.25 times, would have cut that line by more than a third, but stage 3 turns ran past five minutes often enough that the one hour cache is the right choice.

Part selection is the largest line on both boards, 45 percent of the ring’s bill and 48 percent of the glasses’. It is also where the wall clock goes: 43 and 49 minutes against under half an hour for a specification.

What came out

Figure Glasses EV1, 3297c80 Ring EV1, c19ab02
Placed symbols, against the ceiling 90 of 110 90 of 105
Parts, all symbol and pin verified 77 78
Radios BM83 audio, nRF52840 nRF52833, VDDH mode
Standby 3.25 mA ledger 96.9 µA itemised
Design figure against target and ceiling 4.77 mA against 8 and 12 mA 116.3 µA against 150 and 177 µA
Predicted endurance about 50 h on 240 mAh usable about 6 days on 17 mAh usable
Stage-3 turns used, cap 80 46 35 then 38
Package 88 pages 102 pages
FIG. 1, the glasses exploded: frame front, two plano lenses and two temples, with each temple’s PCB, cell, speaker, microphone, touch strip, charging contacts, microphone power switch and NFC loop pulled out above it, with reference numerals

FIG. 1. Glasses, exploded. No display, no camera. Microphone power is a hardware switch under the application controller, off unless the wearer opens a call or a reply. Reference numerals key to the requirement register. Download the SVG.

FIG. 2, the ring exploded along its axis: inner liner with its electrode window, the rigid-flex loop as an open C carrying the controller island, haptic island, LRA and NFC arc, the curved cell, the receive coil and the outer shell with its three touch pads

FIG. 2. Ring, exploded along its axis. No microphone, no camera, no optical or electrical biosensor: the one window on the inner liner is a wear-detect electrode. Every shipping smart ring is a capture device[7][8][9]; this one is a control device. The architecture follows the published Open Ring design record[10]. Download the SVG.

The glasses, as designed

Two radios, because an iPhone carries a call over Bluetooth Classic and the Kyra app needs a Bluetooth Low Energy data channel and a central role toward the ring. The audio module owns the call path and the charger; the controller module owns the sensors, the touch strip, the microphone switch and both BLE links. Everything off the board is dashed.

Block diagram of the glasses EV1: phone and ring on the left, the nRF52840 controller module and BM83 audio module in the centre, touch controller, accelerometer, NFC antenna, amplifiers, speakers, microphone power switch and microphones on the right, USB-C and the protected cell along the bottom

Glasses EV1 block diagram. Download the SVG.

The 23 parts that are not passives, from the bill of materials committed at 3297c80. Every part number is a proposal, flagged unverified in the BOM itself; the package column is the KiCad footprint the symbol was checked against.

Refdes Value Package MPN (proposed, unverified)
U1 BM83 Microchip_BM83 BM83SM1-00AA
U2 MDBT50Q-1MV2 Raytac_MDBT50Q MDBT50Q-1MV2
U3 AT42QT1070 QFN-20-1EP_4x4mm_P0.5mm_EP2.6x2.6mm AT42QT1070-MMHR
U4 KX022-1020 LGA-12_2x2mm_P0.5mm KX022-1020
U5 AP9101CK SOT-23-5 AP9101CK5-AATRG1
U6 PAM8302A MSOP-8-1EP_3x3mm_P0.65mm_EP1.68x1.88mm PAM8302AADCR
U7 PAM8302A MSOP-8-1EP_3x3mm_P0.65mm_EP1.68x1.88mm PAM8302AADCR
Q1 DMG2301L SOT-23 DMG2301L-7
Q2 SI2302 SOT-23 SI2302CDS-T1-GE3
Q3 SI2302 SOT-23 SI2302CDS-T1-GE3
D1 PESD5V0L1BA D_SOD-323 PESD5V0L1BA,115
D2 Green LED_0603_1608Metric LTST-C191KGKT
L1 10uH L_0805_2012Metric LQM2HPN100MG0L
J1 USB-C 16P USB_C_Receptacle_USB2.0_16P USB4105-GF-A
J2 Conn_01x02 JST_SH_BM02B-SRSS-TB_1x02-1MP_P1.00mm_Vertical BM02B-SRSS-TB(LF)(SN)
J3 Conn_01x02 JST_SH_BM02B-SRSS-TB_1x02-1MP_P1.00mm_Vertical BM02B-SRSS-TB(LF)(SN)
J4 Conn_01x02 JST_SH_BM02B-SRSS-TB_1x02-1MP_P1.00mm_Vertical BM02B-SRSS-TB(LF)(SN)
J5 Conn_01x06 Molex_505110-0692_1x06-1MP_P0.50mm_Horizontal 505110-0692
J6 Conn_01x06 Molex_505110-0692_1x06-1MP_P0.50mm_Horizontal 505110-0692
J7 Conn_01x02 JST_SH_BM02B-SRSS-TB_1x02-1MP_P1.00mm_Vertical BM02B-SRSS-TB(LF)(SN)
J8 Conn_02x05 PinHeader_2x05_P1.27mm_Vertical_SMD FTSH-105-01-L-DV-K
J9 Conn_01x04 PinHeader_1x04_P2.54mm_Vertical 61300411121
J10 Conn_01x02 PinHeader_1x02_P2.54mm_Vertical 61300211121
The other 67 rows: passives and test points
Refdes Value Package MPN (proposed, unverified)
R1 1k R_0402_1005Metric RC0402FR-071KL
R2 5.1k R_0402_1005Metric RC0402FR-075K1L
R3 5.1k R_0402_1005Metric RC0402FR-075K1L
R4 330R R_0402_1005Metric RC0402FR-07330RL
R5 2k R_0402_1005Metric RC0402FR-072KL
R6 10k R_0402_1005Metric RC0402FR-0710KL
R7 10k R_0402_1005Metric RC0402FR-0710KL
R8 10k R_0402_1005Metric RC0402FR-0710KL
R9 100k R_0402_1005Metric RC0402FR-07100KL
R10 120k R_0402_1005Metric RC0402FR-07120KL
R11 120k R_0402_1005Metric RC0402FR-07120KL
R12 100R R_0402_1005Metric RC0402FR-07100RL
R13 100R R_0402_1005Metric RC0402FR-07100RL
R14 100R R_0402_1005Metric RC0402FR-07100RL
R15 100R R_0402_1005Metric RC0402FR-07100RL
R16 10R R_0402_1005Metric RC0402FR-0710RL
R17 100k R_0402_1005Metric RC0402FR-07100KL
R18 1k R_0402_1005Metric RC0402FR-071KL
R19 1k R_0402_1005Metric RC0402FR-071KL
R20 1k R_0402_1005Metric RC0402FR-071KL
R21 1k R_0402_1005Metric RC0402FR-071KL
R22 1k R_0402_1005Metric RC0402FR-071KL
R23 4.7k R_0402_1005Metric RC0402FR-074K7L
R24 4.7k R_0402_1005Metric RC0402FR-074K7L
R25 10k R_0402_1005Metric RC0402FR-0710KL
R26 10k R_0402_1005Metric RC0402FR-0710KL
C1 10uF C_0805_2012Metric GRM21BR61C106KE15L
C2 100nF C_0402_1005Metric CL05B104KO5NNNC
C3 100nF C_0402_1005Metric CL05B104KO5NNNC
C4 4.7uF C_0603_1608Metric GRM188R61A475KE15D
C5 10uF C_0805_2012Metric GRM21BR61A106KE19L
C6 100nF C_0402_1005Metric CL05B104KO5NNNC
C7 4.7uF C_0603_1608Metric GRM188R61A475KE15D
C8 100nF C_0402_1005Metric CL05B104KO5NNNC
C9 100nF C_0402_1005Metric CL05B104KO5NNNC
C10 4.7uF C_0603_1608Metric GRM188R61C475KAAJ
C11 10uF C_0805_2012Metric GRM21BR61A106KE19L
C12 100nF C_0402_1005Metric CL05B104KO5NNNC
C13 1uF C_0402_1005Metric CL05A105KA5NQNC
C14 4.7uF C_0603_1608Metric GRM188R61A475KE15D
C15 1uF C_0402_1005Metric CL05A105KA5NQNC
C16 220nF C_0402_1005Metric CL05B224KO5NNNC
C17 220nF C_0402_1005Metric CL05B224KO5NNNC
C18 220nF C_0402_1005Metric CL05B224KO5NNNC
C19 220nF C_0402_1005Metric CL05B224KO5NNNC
C20 100nF C_0402_1005Metric CL05B104KO5NNNC
C21 100nF C_0402_1005Metric CL05B104KO5NNNC
C22 10uF C_0805_2012Metric GRM21BR61A106KE19L
C23 1uF C_0402_1005Metric CL05A105KA5NQNC
C24 100nF C_0402_1005Metric CL05B104KO5NNNC
C25 100nF C_0402_1005Metric CL05B104KO5NNNC
C26 100nF C_0402_1005Metric CL05B104KO5NNNC
C27 100pF C_0402_1005Metric GJM1555C1H101JB01D
C28 100pF C_0402_1005Metric GJM1555C1H101JB01D
TP1 GND TestPoint_Pad_D1.0mm none (pad or hole)
TP2 GND TestPoint_Pad_D1.0mm none (pad or hole)
TP3 VBAT_PROT TestPoint_Pad_D1.0mm none (pad or hole)
TP4 VDD_3V0 TestPoint_Pad_D1.0mm none (pad or hole)
TP5 MIC_VDD TestPoint_Pad_D1.0mm none (pad or hole)
TP6 BT_UART_TXD TestPoint_Pad_D1.0mm none (pad or hole)
TP7 BT_UART_RXD TestPoint_Pad_D1.0mm none (pad or hole)
TP8 SPK_L_P TestPoint_Pad_D1.0mm none (pad or hole)
TP9 SPK_R_P TestPoint_Pad_D1.0mm none (pad or hole)
TP10 SDA TestPoint_Pad_D1.0mm none (pad or hole)
TP11 SCL TestPoint_Pad_D1.0mm none (pad or hole)
TP12 MIC_EN_N TestPoint_Pad_D1.0mm none (pad or hole)
TP13 AMP_SD_N TestPoint_Pad_D1.0mm none (pad or hole)

The ring, as designed

One radio and no regulator: the nRF52833 takes the cell directly in high-voltage mode. A dedicated touch controller scans on its own and wakes the controller once per gesture, which is the whole power budget. Charging is inductive through a discrete rectifier, and the haptic pulse is drawn from a capacitor bank rather than the cell.

Block diagram of the ring EV1: phone and glasses on the left, the nRF52833 in the centre, NFC antenna, touch controller with its off-board electrodes, accelerometer, haptic driver with the LRA and capacitor bank on the right and the charging chain from receive coil through rectifier and charger to the protected cell along the bottom

Ring EV1 block diagram. Download the SVG.

The 23 parts that are not passives, from the bill of materials committed at c19ab02, on the same terms.

Refdes Value Package MPN (proposed, unverified)
J5 Conn_01x02 JST_SH_SM02B-SRSS-TB_1x02-1MP_P1.00mm JST SM02B-SRSS-TB(LF)(SN)
U6 AP9101CK6 SOT-23-6 AP9101CK6-AWDE-7
Q1 Dual N-MOS SOT-363_SC-70-6 DMN62D0LDW-7
U5 MCP73831-2-OT SOT-23-5 Microchip MCP73831T-2ACI/OT
D1 Green LED_0603_1608Metric Würth 150060GS75000
J6 Conn_01x02 JST_SH_SM02B-SRSS-TB_1x02-1MP_P1.00mm JST SM02B-SRSS-TB(LF)(SN)
D2 BAT54S SOT-23 Nexperia BAT54S,215
D3 BAT54S SOT-23 Nexperia BAT54S,215
D4 5.1V D_SOD-123 onsemi MMSZ5231BT1G
U1 nRF52833 QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm Nordic nRF52833-QIAA-R
Y1 32MHz Crystal_SMD_2016-4Pin_2.0x1.6mm Abracon ABM8-32.000MHZ-B2-T
Y2 32.768kHz Crystal_SMD_3215-2Pin_3.2x1.5mm Abracon ABS07-32.768KHZ-9-T
L1 10uH L_0805_2012Metric Murata LQM2HPN100MJ0L
ANT1 2.4GHz Johanson_2450AT18A100 Johanson 2450AT18A100E
L2 1.0nH L_0402_1005Metric Murata LQP15MN1N0B02D
J8 Conn_01x02 JST_SH_SM02B-SRSS-TB_1x02-1MP_P1.00mm JST SM02B-SRSS-TB(LF)(SN)
U2 AT42QT1070 QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm Microchip AT42QT1070-MMH
J4 Conn_01x06 Hirose_FH12-6S-0.5SH_1x06-1MP_P0.50mm_Horizontal Hirose FH12-6S-0.5SH(55)
U3 KX022-1020 LGA-12_2x2mm_P0.5mm Kionix KX022-1020
U4 DRV2605L VSSOP-10_3x3mm_P0.5mm TI DRV2605LDGSR
J3 Conn_01x02 JST_SH_SM02B-SRSS-TB_1x02-1MP_P1.00mm JST SM02B-SRSS-TB(LF)(SN)
J1 Conn_02x05 PinHeader_2x05_P1.27mm_Vertical Samtec FTSH-105-01-L-DV-K
J7 Conn_01x02 PinHeader_1x02_P1.27mm_Vertical Harwin M50-3500242
The other 67 rows: passives, test points and mounting holes
Refdes Value Package MPN (proposed, unverified)
R1 330R R_0402_1005Metric Yageo RC0402FR-07330RL
R2 2k R_0402_1005Metric Yageo RC0402FR-072KL
C1 100nF C_0402_1005Metric Murata GRM155R71C104KA88D
R3 66.5k R_0402_1005Metric Yageo RC0402FR-0766K5L
C2 4.7uF C_0805_2012Metric Murata GRM21BR61C475KA88L
C3 4.7uF C_0603_1608Metric Murata GRM188R61A475KE15D
R4 2.2k R_0402_1005Metric Yageo RC0402FR-072K2L
R5 100k R_0402_1005Metric Yageo RC0402FR-07100KL
R6 100k R_0402_1005Metric Yageo RC0402FR-07100KL
C4 560pF C_0402_1005Metric Murata GRM1555C1H561JA01D
C5 DNP C_0402_1005Metric none, position not fitted at build
C6 10uF C_0805_2012Metric Murata GRM21BR61C106KE15L
C7 100nF C_0402_1005Metric Murata GRM155R71C104KA88D
R7 1M R_0402_1005Metric Yageo RC0402FR-071ML
R8 470k R_0402_1005Metric Yageo RC0402FR-07470KL
C8 100nF C_0402_1005Metric Murata GRM155R71C104KA88D
C9 12pF C_0402_1005Metric Murata GRM1555C1H120JA01D
C10 12pF C_0402_1005Metric Murata GRM1555C1H120JA01D
C11 12pF C_0402_1005Metric Murata GRM1555C1H120JA01D
C12 12pF C_0402_1005Metric Murata GRM1555C1H120JA01D
C13 1uF C_0402_1005Metric Murata GRM155R60J105KE19D
C14 100nF C_0402_1005Metric Murata GRM155R71C104KA88D
C15 100nF C_0402_1005Metric Murata GRM155R71C104KA88D
C16 820pF C_0402_1005Metric Murata GRM1555C1H821JA01D
C17 47nF C_0402_1005Metric Murata GRM155R71C473KA01D
C18 100nF C_0402_1005Metric Murata GRM155R71C104KA88D
C19 100nF C_0402_1005Metric Murata GRM155R71C104KA88D
C20 100nF C_0402_1005Metric Murata GRM155R71C104KA88D
C21 4.7uF C_0603_1608Metric Murata GRM188R61A475KE15D
C22 100nF C_0402_1005Metric Murata GRM155R71C104KA88D
C23 4.7uF C_0603_1608Metric Murata GRM188R61A475KE15D
R9 10k R_0402_1005Metric Yageo RC0402FR-0710KL
R10 4.7k R_0402_1005Metric Yageo RC0402FR-074K7L
R11 4.7k R_0402_1005Metric Yageo RC0402FR-074K7L
C24 0.5pF C_0402_1005Metric Murata GRM1555C1HR50BA01D
C25 0.5pF C_0402_1005Metric Murata GRM1555C1HR50BA01D
C26 300pF C_0402_1005Metric Murata GRM1555C1H301JA01D
C27 300pF C_0402_1005Metric Murata GRM1555C1H301JA01D
R12 1k R_0402_1005Metric Yageo RC0402FR-071KL
R13 1k R_0402_1005Metric Yageo RC0402FR-071KL
R14 1k R_0402_1005Metric Yageo RC0402FR-071KL
R15 1k R_0402_1005Metric Yageo RC0402FR-071KL
R16 1k R_0402_1005Metric Yageo RC0402FR-071KL
R17 10k R_0402_1005Metric Yageo RC0402FR-0710KL
R18 10k R_0402_1005Metric Yageo RC0402FR-0710KL
C28 100nF C_0402_1005Metric Murata GRM155R71C104KA88D
C29 100nF C_0402_1005Metric Murata GRM155R71C104KA88D
C30 100nF C_0402_1005Metric Murata GRM155R71C104KA88D
R19 15R R_0805_2012Metric Yageo RC0805FR-0715RL
R20 100k R_0402_1005Metric Yageo RC0402FR-07100KL
C31 220uF C_1210_3225Metric Murata GRM32EC80J227ME05L
C32 220uF C_1210_3225Metric Murata GRM32EC80J227ME05L
C33 220uF C_1210_3225Metric Murata GRM32EC80J227ME05L
C34 220uF C_1210_3225Metric Murata GRM32EC80J227ME05L
C35 100nF C_0402_1005Metric Murata GRM155R71C104KA88D
C36 1uF C_0402_1005Metric Murata GRM155R60J105KE19D
TP1 TP TestPoint_Pad_D1.0mm none, copper pad
TP2 TP TestPoint_Pad_D1.0mm none, copper pad
TP3 TP TestPoint_Pad_D1.0mm none, copper pad
TP4 TP TestPoint_Pad_D1.0mm none, copper pad
TP5 TP TestPoint_Pad_D1.0mm none, copper pad
TP6 TP TestPoint_Pad_D1.0mm none, copper pad
TP7 TP TestPoint_Pad_D1.0mm none, copper pad
TP8 TP TestPoint_Pad_D1.0mm none, copper pad
TP9 TP TestPoint_Pad_D1.0mm none, copper pad
H1 M2 MountingHole_2.2mm_M2 none, mechanical
H2 M2 MountingHole_2.2mm_M2 none, mechanical

What this does not prove

  • Anything past part selection. There is no schematic, no ERC, no layout and no measurement. Both packages say so on their first pages.

  • That the parts are right. Every part number is proposed from catalogue knowledge and flagged UNVERIFIED, with the datasheet claim that must be checked written next to it. That check is a lookup, not a design change. It has not been done.

  • That the budgets hold. The glasses figure rests on one assumed number, the audio module’s sniff current, entered at 3.00 mA and marked as assumed. The ring’s haptic bank came out smaller than the brief assumed, and the pulse it can carry is now an open item. Both are the first things the boards would measure.

  • That Kyra wants any of this. The two biggest decisions, no display and no camera, were ours, taken from a three-day prototype and a two-sentence roadmap. They are listed as open items addressed to Kyra, unasked.

What it does prove

That the slow part of hardware comes before the schematic: turning intent into a specification precise enough to argue with, choosing an architecture and building a bill of materials in which every part is known to exist, to have a symbol, to have the pins you will wire and to fit a power budget itemised line by line. That part took a working day for two boards, and every claim in it traces to a commit, a decision number or an assumption with its consequence written down.

Software teams take that for granted: a spec, a design, a build, a diff, a log. Hardware mostly does not have it, and that is the gap copperhead is built for[11]. The proof is not the pitch. It is the record above, which anyone can check out.

References

Each entry says which claim in the text it carries. Web sources were read on 2 September 2026; local sources are files in the engagement record, named by the commit they were built from.

  1. Animesh Chouhan, reply to @_sahildhull on X, 27 August 2026.
    https://x.com/animeshsingh38/status/2093044844423946444
    The claim this page sets out to prove: imagine what you could build if hardware design moved as fast as software.

  2. Kyra, product page, quoted in full.
    https://kyrainterface.com/
    The entire public hardware specification (The input) and the privacy commitment that became a hardware constraint on both boards. Re-checked the same day the boards were designed; unchanged.

  3. Sahil Dhull, LinkedIn post, 1 September 2026.
    https://www.linkedin.com/feed/update/urn:li:activity:7500590483107344384/
    The glasses V0 built in three days and demonstrated by a phone call, which is the only evidence that the glasses carry an audio path. It is the reason the day’s scope moved from a ring alone to glasses and ring. Nothing else about the product is inferred from it.

  4. Kyra R1 EV1, the escalation ring engine: design documentation package, revision c19ab02, 102 pages.
    /blog/kyra-ring-ev1-design-package-c19ab02.pdf
    Every ring figure in The record and What came out: the stage commits, the 90-symbol BOM, the itemised 96.9 µA idle draw and the 116.3 µA figure with contingency. Built from the workspace at that commit through git archive, so the revision on its cover is checkable.

  5. Kyra R1 EV1, the escalation glasses engine: design documentation package, revision 3297c80, 88 pages.
    /blog/kyra-glasses-ev1-design-package-3297c80.pdf
    Every glasses figure: the stage commits, the 90-symbol BOM, the 3.25 mA standby ledger and 4.77 mA day average and the note that the audio module’s sniff current is entered as assumed, which What this does not prove relies on.

  6. Anthropic, Claude pricing.
    https://platform.claude.com/docs/en/about-claude/pricing
    The Claude Opus 5 rates behind every cost in What each stage cost, including the one hour cache write and cache read multipliers. Token counts are the Claude Agent SDK’s session records, one usage entry per API call, deduplicated by message id.

  7. Becky Stern, Oura Ring teardown (Gen 3 and Gen 2), 2022.
    https://beckystern.com/2022/04/17/oura-ring-teardown-gen-3-and-gen-2/
    The optical heart-rate stack, 16 mAh cell and inductive charging inside a shipping ring: one of three teardowns behind every shipping smart ring is a capture device (FIG. 2 caption).

  8. iFixit, Samsung Galaxy Ring Chip ID.
    https://www.ifixit.com/Guide/Samsung+Galaxy+Ring+Chip+ID/176114
    Nordic nRF5340, NFC tag, external NOR flash and wireless charging in the Galaxy Ring: the second of the three teardowns and the source for Nordic silicon as the default in the ring’s part research.

  9. DigiKey Maker, Ultrahuman Ring Air teardown, 2024.
    https://www.digikey.com/en/maker/blogs/2024/ultrahuman-ring-air-teardown
    nRF52840, flex PCB, LEDs and photodiode: the third teardown. The optical stack these three share is what the Kyra ring omits and what buys its power budget.

  10. Memfault Interrupt, Smart ring development, parts 1 and 2, with the open-source hardware at https://github.com/stawiski/open-ring.
    https://interrupt.memfault.com/blog/smart-ring-development-part-1
    The published design record the ring’s architecture leans on: wafer-level packaging forced by a 2.6 to 2.9 mm band, rigid-flex, 6.78 MHz induction charging with a discrete rectifier and a capacitor bank for the haptic. It is a design one may read, not one being shipped; the Kyra ring departs from it on the touch controller and the second MCU.

  11. copperhead.
    https://copperhead.sh
    The pipeline that produced the record: copperhead create, version 0.10.0, eight stages, of which the first three were run here.